Thermal Excellence for Tomorrow’s Breakthroughs.
Lincotec’s advanced heat dissipation substrates deliver efficient thermal management for reliable electronics.
With innovative design and quality materials, we support technological progress and sustainability.
The emergence of advanced heat dissipation substrates originated from the increasing inadequacy of traditional printed circuit boards (PCBs) and thick-film alumina substrates in meeting demands for advanced heat dissipation capacity, circuit precision, current-carrying capability, and reliability.
As electronic components operate, the generated heat requires more efficient conduction pathways to address the issue of waste heat accumulation during electrical-to-optical conversion, which shortens service life. Concurrently, finer circuit patterning is essential to interconnect increasingly miniaturized, high-density chips.
